Submicron Polyimide Plastic Membrane Film Substrate For Precision Flexible Circuits

Product Overview

This revolutionary polyimide substrate incorporates proprietary molecular alignment technology and ceramic nano-reinforcements to achieve unprecedented dimensional stability (±0.01% dimensional change under 85°C/85% RH), representing a 60% improvement over conventional polyimide substrates. Designed for advanced flexible electronics requiring sub-micron registration accuracy, it maintains exceptional circuit integrity through 3000+ thermal cycles (-65°C to 280°C) while delivering 50% enhanced adhesion strength and 40% reduced moisture absorption for next-generation high-density interconnects.

Breakthrough Performance Advantages

1. Sub-Micron Dimensional Stability

   • ±0.01% dimensional change after 2000 hours at 85°C/85% RH (60% improvement vs. standard PI films)

   • Ultra-low CTE 1.5-2.0 ppm/°C (X/Y axis) precisely matched to silicon and gallium arsenide

   • Near-zero hygroscopic expansion coefficient <0.005% (70% reduction vs. conventional substrates)

2. Extended Mechanical Endurance

   • 55% higher tear strength retention after thermal aging at 200°C for 5000 hours

   • Withstands 2,000,000 dynamic flex cycles at 0.3mm bend radius

   • Peel strength >10 N/cm after multiple lead-free reflow processes at 260°C

3. High-Frequency Electrical Performance

   • Dielectric constant (Dk) 3.0 ± 0.01 across 1-60 GHz frequency range

   • Dissipation factor (Df) <0.001 after 1000 hours humidity resistance testing

   • Volume resistivity >10¹⁸ Ω·cm at 300°C

4. Advanced Manufacturing Compatibility

   • Laser drillable with 5μm microvia capability for ultra-HDI circuits

   • Compatible with extreme thin copper foils (≤1μm) for 5μm line/space patterning

   • Chemical resistance to all known PCB processing chemicals and solvents

Target Applications

• Advanced Flexible Electronics

  • Ultra-high density flex circuits for medical imaging and diagnostic systems

  • Multi-layer rigid-flex boards for aerospace and satellite systems

  • 2.5D/3D semiconductor packaging interposers requiring sub-micron alignment

• Precision Instrumentation Systems

  • Quantum computing and photonic integration circuits

  • Autonomous vehicle LiDAR and vision systems

  • Aerospace guidance and navigation systems

• Next-Generation Electronics

  • Foldable and rollable display electronics

  • Implantable medical devices and biosensors

  • Advanced automotive radar and communication systems